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Evaluation of micro laser sintering metal 3D-printing technology for the development of waveguide passive devices up to 325 GHz
IEEE/MTT-S International Microwave Symposium, IMS 2020, Los Angeles, 04-08-2020, Proceedings of 2020 IEEE MTT-S International Microwave Symposium, IMS 2020, IEEE, 04-08-2020Communication dans un congrès avec actesfulltext
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A G-band Packaged Amplified Noise Source using SiGe BiCMOS 55 nm Technology
IEEE Transactions on Microwave Theory and Techniques, Institute of Electrical and Electronics Engineers, 03-2024, 72; 3, 1775 - 1789Compte-rendu et recension critique d'ouvragefulltext
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Improved performance of flexible CMOS technology using ultimate thinning and transfer bonding
6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-09-2016, 6th Electronic System-Integration Technology Conference (ESTC), IEEE, 2016Communication dans un congrès avec actes -
Femtosecond pulsed laser for advanced photonic packaging
7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, 18-09-2018Communication dans un congrès avec actes -
[Invited] Functional packaging of RF, mmW and photonic functions based on femtosecond laser micromachining
19th International Nanotech Symposium NANO KOREA 2021, TS10-Nanofabrication & Measurements, Seoul, 07-07-2021Communication dans un congrès avec actesfulltext
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Substrate-Induced Dissipative and Non-Linear Effects in RF Switches: Probing Ultimate Performance Based on Laser-Machined Membrane Suspension
Electronics, MDPI, 2022, 11; 15, 2333Article dans une revue scientifiquefulltext
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Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications
SPIE Photonics West, Conference 10906 - Laser-based Micro- and Nanoprocessing XIII, San Francisco, 02-02-2019, SPIE-Int. Soc. Opt. Eng., SPIE-Int. Soc. Opt. Eng. 10906 (2019), SPIE, 07-02-2019Communication dans un congrès avec actesfulltext
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Large-area femtosecond laser ablation of Silicon to create membrane with high performance CMOS-SOI RF functions
2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, 18-09-2018, Proceedings of 7th Electronics System-Integration Technology Conference, ESTC 2018, Dresden, Germany, IEEE, 21-09-2018Communication dans un congrès avec actes -
Substrate engineering of inductors on SOI for improvement of Q-factor and application in LNA
IEEE Journal of the Electron Devices Society, IEEE Electron Devices Society, 27-08-2020, 8, 959-969Article dans une revue scientifiquefulltext
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A G-band Packaged Amplified Noise Source using SiGe BiCMOS 55 nm Technology
IEEE Transactions on Microwave Theory and Techniques, Institute of Electrical and Electronics Engineers, 03-2024, 72; 3, 1775 - 1789Article dans une revue scientifiquefulltext