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Improving off-state capacitance of SOI-CMOS RF switches: how good are air microcavities?
IEEE 53rd European Solid-State Device Research Conference, ESSDERC, Lisbon, 11-09-2023, Proceedings of the IEEE 53rd European Solid-State Device Research Conference, ESSDERC, IEEECommunication dans un congrès avec actestexte intégral -
Substrate-Induced Dissipative and Non-Linear Effects in RF Switches: Probing Ultimate Performance Based on Laser-Machined Membrane Suspension
Electronics, MDPI, 2022, 11; 15, 2333Compte-rendu et recension critique d'ouvragetexte intégral -
Mitigation of substrate coupling effects in RF switch by localized substrate removal using laser processing
Pré-publication ou Document de travailtexte intégral -
Large-area femtosecond laser ablation of Silicon to create membrane with high performance CMOS-SOI RF functions
2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, 18-09-2018, Proceedings of 7th Electronics System-Integration Technology Conference, ESTC 2018, Dresden, Germany, IEEE, 21-09-2018Communication dans un congrès avec actes -
Radio-frequency and low noise characteristics of SOI technology on plastic for flexible electronics
Solid-State Electronics, Elsevier, 2013, 90, 73-78Compte-rendu et recension critique d'ouvragetexte intégral -
150-GHz RF SOI-CMOS technology in ultrathin regime on organic substrate
IEEE Electron Device Letters, Institute of Electrical and Electronics Engineers, 2011, 32, 1510-1512Compte-rendu et recension critique d'ouvrage -
A CMOS Compatible Thermoelectric Device made of Crystalline Silicon Membranes with Nanopores
Nanotechnology, Institute of Physics, 10-12-2022, 33; 50, 505403Compte-rendu et recension critique d'ouvragetexte intégral -
Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications
SPIE Photonics West, Conference 10906 - Laser-based Micro- and Nanoprocessing XIII, San Francisco, 02-02-2019, SPIE-Int. Soc. Opt. Eng., SPIE-Int. Soc. Opt. Eng. 10906 (2019), SPIE, 07-02-2019Communication dans un congrès avec actestexte intégral -
Large-area femtosecond laser milling of silicon employing trench analysis
Optics and Laser Technology, Elsevier, 2021, 138, 106866Compte-rendu et recension critique d'ouvragetexte intégral -
Substrate engineering of inductors on SOI for improvement of Q-factor and application in LNA
IEEE Journal of the Electron Devices Society, IEEE Electron Devices Society, 27-08-2020, 8, 959-969Compte-rendu et recension critique d'ouvragetexte intégral