UV and IR laser induced ablation of ...
Document type :
Communication dans un congrès avec actes
DOI :
Title :
UV and IR laser induced ablation of Al2O3/SiN:H and a-Si:H/SiN:H
Author(s) :
Schutz-Kuchly, T. [Auteur]
Laboratoire des sciences de l'ingénieur, de l'informatique et de l'imagerie [ICube]
Slaoui, A. [Auteur]
Laboratoire des sciences de l'ingénieur, de l'informatique et de l'imagerie [ICube]
Zelgowski, J. [Auteur]
Bahouka, A. [Auteur]
Pawlik, M. [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Vilcot, Jean-Pierre [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Delbos, E. [Auteur]
Bouttemy, M. [Auteur]
Institut Lavoisier de Versailles [ILV]
Cabal, R. [Auteur]
Laboratoire des sciences de l'ingénieur, de l'informatique et de l'imagerie [ICube]
Slaoui, A. [Auteur]
Laboratoire des sciences de l'ingénieur, de l'informatique et de l'imagerie [ICube]
Zelgowski, J. [Auteur]
Bahouka, A. [Auteur]
Pawlik, M. [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Vilcot, Jean-Pierre [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Delbos, E. [Auteur]
Bouttemy, M. [Auteur]
Institut Lavoisier de Versailles [ILV]
Cabal, R. [Auteur]
Conference title :
4th Photovoltaic Technical Conference, PVTC 2013, ''Thin Film and Advanced Silicon Solutions 2013''
City :
Aix-en-Provence
Country :
France
Start date of the conference :
2013
Journal title :
EPJ Photovoltaics
Publication date :
2014
HAL domain(s) :
Sciences de l'ingénieur [physics]
English abstract : [en]
Experimental work on laser induced ablation of thin Al2O3(20 nm)/SiN:H (70 nm) and a-Si:H (20 nm)/SiN:H (70 nm) stacks acting, respectively, as p-type and n-type silicon surface passivation layers is reported. Results ...
Show more >Experimental work on laser induced ablation of thin Al2O3(20 nm)/SiN:H (70 nm) and a-Si:H (20 nm)/SiN:H (70 nm) stacks acting, respectively, as p-type and n-type silicon surface passivation layers is reported. Results obtained using two different laser sources are compared. The stacks are efficiently removed using a femtosecond infra-red laser (1030 nm wavelength, 300 fs pulse duration) but the underlying silicon surface is highly damaged in a ripple-like pattern. This collateral effect is almost completely avoided using a nanosecond ultra-violet laser (248 nm wavelength, 50 ns pulse duration), however a-Si:H flakes and Al2O3 lace remain after ablation process.Show less >
Show more >Experimental work on laser induced ablation of thin Al2O3(20 nm)/SiN:H (70 nm) and a-Si:H (20 nm)/SiN:H (70 nm) stacks acting, respectively, as p-type and n-type silicon surface passivation layers is reported. Results obtained using two different laser sources are compared. The stacks are efficiently removed using a femtosecond infra-red laser (1030 nm wavelength, 300 fs pulse duration) but the underlying silicon surface is highly damaged in a ripple-like pattern. This collateral effect is almost completely avoided using a nanosecond ultra-violet laser (248 nm wavelength, 50 ns pulse duration), however a-Si:H flakes and Al2O3 lace remain after ablation process.Show less >
Language :
Anglais
Peer reviewed article :
Oui
Audience :
Non spécifiée
Popular science :
Non
Source :
Files
- https://www.epj-pv.org/articles/epjpv/pdf/2014/01/pv130011.pdf
- Open access
- Access the document
- https://hal.archives-ouvertes.fr/hal-00811798/document
- Open access
- Access the document
- https://hal.archives-ouvertes.fr/hal-00811798/document
- Open access
- Access the document
- document
- Open access
- Access the document
- pv130011.pdf
- Open access
- Access the document
- pv130011.pdf
- Open access
- Access the document