Title :

Numerical approach to quantify and characterize interface mechanical behavior between thin layer substrate and biological tissues

Author(s) :

Sawan, Marwa [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Université Polytechnique Hauts-de-France [UPHF]
Reda, Hilal [Auteur]
Lebanese University [Beirut] [LU]
Saad, Nadine [Auteur]
Lebanese University [Beirut] [LU]
Hamadeh, Abbass [Auteur]
Lebanese University [Beirut] [LU]
Bin, Sun [Auteur]
Qingdao University [QDU]
Nassar, Georges [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Matériaux et Acoustiques pour MIcro et NAno systèmes intégrés - IEMN [MAMINA - IEMN]

Journal title :

Journal of Mechanics in Medicine and Biology

Pages :

2150026

Publisher :

World Scientific Publishing

Publication date :

2021-08

ISSN :

0219-5194

English keyword(s) :

Adhesion
interface
skin
numerical model
biomechanical

HAL domain(s) :

Sciences de l'ingénieur [physics]

English abstract : [en]

In this paper, we investigate the behavior of biological tissues (skin) coupled to a substrate (sensor) based on a numerical model taking into account the relationship between strain/stress components at the interface. ...
Show more >In this paper, we investigate the behavior of biological tissues (skin) coupled to a substrate (sensor) based on a numerical model taking into account the relationship between strain/stress components at the interface. Based on this study, we understand and quantify the most appropriate biomechanical factors in order to optimize sensor/biological tissue interface conditions. A micromechanical description based on a mathematical formulation has been developed to evaluate the biomechanical behavior provided by a 2D viscoelastic model of Kelvin–Voigt. The results show a spatio-temporal law of tissue motion highlighting the need for an optimized interface for reliable data transmission in the case of connected device in a dynamic movement or in the manufacturing of intelligent and reactive prosthesis device.Show less >

Language :

Anglais

Peer reviewed article :

Oui

Audience :

Internationale

Popular science :

Non

Collections :

• Institut d'Électronique, de Microélectronique et de Nanotechnologie (IEMN) - UMR 8520

Source :

Harvested from HAL