Optimized emitter-base interface cleaning ...
Document type :
Article dans une revue scientifique
Title :
Optimized emitter-base interface cleaning for advanced Heterojunction Bipolar Transistors
Author(s) :
Brezza, E. [Auteur correspondant]
Puissance - IEMN [PUISSANCE - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
STMicroelectronics [Crolles] [ST-CROLLES]
Deprat, F. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
de Buttet, C. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information [CEA-LETI]
Gauthier, A. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Gregoire, M. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Guiheux, D. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Guyader, V. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Laboratoire Cycles Géochimiques et ressources [LCG]
Juhel, M. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Berbezier, I. [Auteur]
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence [IM2NP]
Assaf, E. [Auteur]
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence [IM2NP]
Favre, L. [Auteur]
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence [IM2NP]
Chevalier, P. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Hôpital Louis Pradel [CHU - HCL]
Gaquière, Christophe [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Puissance - IEMN [PUISSANCE - IEMN]
Defrance, N. [Auteur]
Puissance - IEMN [PUISSANCE - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Puissance - IEMN [PUISSANCE - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
STMicroelectronics [Crolles] [ST-CROLLES]
Deprat, F. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
de Buttet, C. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information [CEA-LETI]
Gauthier, A. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Gregoire, M. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Guiheux, D. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Guyader, V. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Laboratoire Cycles Géochimiques et ressources [LCG]
Juhel, M. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Berbezier, I. [Auteur]
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence [IM2NP]
Assaf, E. [Auteur]
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence [IM2NP]
Favre, L. [Auteur]
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence [IM2NP]
Chevalier, P. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Hôpital Louis Pradel [CHU - HCL]
Gaquière, Christophe [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Puissance - IEMN [PUISSANCE - IEMN]
Defrance, N. [Auteur]
Puissance - IEMN [PUISSANCE - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Journal title :
Solid-State Electronics
Pages :
108654
Publisher :
Elsevier
Publication date :
2023-06
ISSN :
0038-1101
English keyword(s) :
Heterojunction Bipolar Transistor
Interface
Hydrofluoric acid etching
SiconiTM etching
Thermal treatment
Interface
Hydrofluoric acid etching
SiconiTM etching
Thermal treatment
HAL domain(s) :
Physique [physics]
Sciences de l'ingénieur [physics]
Sciences de l'ingénieur [physics]
English abstract : [en]
A B S T R A C THeterojunction Bipolar Transistors needed for high-frequency applications require precise dopant control. Insitu doped epitaxies used during device fabrication rely on surface preparation to obtain an optimized ...
Show more >A B S T R A C THeterojunction Bipolar Transistors needed for high-frequency applications require precise dopant control. Insitu doped epitaxies used during device fabrication rely on surface preparation to obtain an optimized dopingprofile. Defects due to imperfect cleaning relates to high emitter resistance and low-frequency noise.Base epitaxy is followed by the fabrication of thin L-shaped oxide spacers and in-situ arsenic-doped emitterepitaxy by Low Pressure Chemical Vapor Deposition. A cleaning step between spacers formation and emitterepitaxy is mandatory to remove residual contamination. Hydrofluoric acid (HF) wet cleaning, in-situ remoteplasma cleaning (SiconiTM) and thermal treatments have been tested. A minimum etching budget is sought forlimiting spacer consumption while adequately cleaning the interface.Time Of Flight-Secondary Ion Mass Spectroscopy (TOF-SIMS) and High-Resolution Transmission ElectronMicroscopy (HR-TEM) are used to characterize the interface and measure levels of arsenic, oxygen, fluorineand carbon. Emitter resistance and base-emitter breakdown voltage measurements are used to show the impacton electrical figures of merit. Siconi targeting 10 Å of thermal oxide removal followed by a thermal treatment(800 ◦C, 60 s) in the deposition chamber results the best process among the tested ones.Show less >
Show more >A B S T R A C THeterojunction Bipolar Transistors needed for high-frequency applications require precise dopant control. Insitu doped epitaxies used during device fabrication rely on surface preparation to obtain an optimized dopingprofile. Defects due to imperfect cleaning relates to high emitter resistance and low-frequency noise.Base epitaxy is followed by the fabrication of thin L-shaped oxide spacers and in-situ arsenic-doped emitterepitaxy by Low Pressure Chemical Vapor Deposition. A cleaning step between spacers formation and emitterepitaxy is mandatory to remove residual contamination. Hydrofluoric acid (HF) wet cleaning, in-situ remoteplasma cleaning (SiconiTM) and thermal treatments have been tested. A minimum etching budget is sought forlimiting spacer consumption while adequately cleaning the interface.Time Of Flight-Secondary Ion Mass Spectroscopy (TOF-SIMS) and High-Resolution Transmission ElectronMicroscopy (HR-TEM) are used to characterize the interface and measure levels of arsenic, oxygen, fluorineand carbon. Emitter resistance and base-emitter breakdown voltage measurements are used to show the impacton electrical figures of merit. Siconi targeting 10 Å of thermal oxide removal followed by a thermal treatment(800 ◦C, 60 s) in the deposition chamber results the best process among the tested ones.Show less >
Language :
Anglais
Peer reviewed article :
Oui
Audience :
Internationale
Popular science :
Non
Source :