The path to 1Tb/s and beyond datacenter ...
Document type :
Autre communication scientifique (congrès sans actes - poster - séminaire...): Communication dans un congrès avec actes
DOI :
Permalink :
Title :
The path to 1Tb/s and beyond datacenter interconnect networks: technologies, components, and subsystems
Author(s) :
Spyropoulou, Maria [Auteur]
Kanakis, Giannis [Auteur]
Jiao, Yuqing [Auteur]
Calabretta, Nicola [Auteur]
Williams, Kevin [Auteur]
University of Reading [UOR]
Nodjiadjim, Virginie [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Hersent, Romain [Auteur]
Alcatel-Thalès III-V lab [III-V Lab]
Nokia Bell Labs
Konczykowska, Agnieszka [Auteur]
Alcatel-Thalès III-V lab [III-V Lab]
Schatz, Richard [Auteur]
KTH Royal Institute of Technology [Stockholm] [KTH]
Ozolins, Oskars [Auteur]
Joharifar, Mahdieh [Auteur]
Zverina, Jakub [Auteur]
Žoldák, Martin [Auteur]
Bakopoulos, Paraskevas [Auteur]
National Technical University of Athens [Athens] [NTUA]
Patronas, Giannis [Auteur]
Avramopoulos, Hercules [Auteur]
National Technical University of Athens [Athens] [NTUA]
Kanakis, Giannis [Auteur]
Jiao, Yuqing [Auteur]
Calabretta, Nicola [Auteur]
Williams, Kevin [Auteur]
University of Reading [UOR]
Nodjiadjim, Virginie [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Hersent, Romain [Auteur]
Alcatel-Thalès III-V lab [III-V Lab]
Nokia Bell Labs
Konczykowska, Agnieszka [Auteur]
Alcatel-Thalès III-V lab [III-V Lab]
Schatz, Richard [Auteur]
KTH Royal Institute of Technology [Stockholm] [KTH]
Ozolins, Oskars [Auteur]
Joharifar, Mahdieh [Auteur]
Zverina, Jakub [Auteur]
Žoldák, Martin [Auteur]
Bakopoulos, Paraskevas [Auteur]
National Technical University of Athens [Athens] [NTUA]
Patronas, Giannis [Auteur]
Avramopoulos, Hercules [Auteur]
National Technical University of Athens [Athens] [NTUA]
Conference title :
Metro and Data Center Optical Networks and Short-Reach Links IV
City :
Online Only
Country :
Etats-Unis d'Amérique
Start date of the conference :
2021-03-06
Publisher :
SPIE
HAL domain(s) :
Sciences de l'ingénieur [physics]
Physique [physics]
Physique [physics]
English abstract : [en]
Modern IoT and 5G applications are driving the growth of Internet traffic and impose stringent requirements to datacenter operators for keeping pace with the increasing bandwidth and low-latency demands. At the same time, ...
Show more >Modern IoT and 5G applications are driving the growth of Internet traffic and impose stringent requirements to datacenter operators for keeping pace with the increasing bandwidth and low-latency demands. At the same time, datacenters suffer from increasing number of interconnections dictating the deployment of novel architectures and high-radix switches. The ratification of 400 GbE standard is driving the market of optical transceivers nevertheless, a technology upgrade will be soon necessary to meet the tremendous traffic growth. In this paper, we present the development of 800 Gb/s and 1Tb/s optical transceivers migrating to 100 Gbaud per lane and employing wafer-scale bonding of InP membranes and InP-DHBT electronics as well as advanced co-packaging schemes. The InP membrane platform is also exploited for the development of novel ultra-fast optical space switches based on a modular architecture design for scaling to large number of I/O ports.Show less >
Show more >Modern IoT and 5G applications are driving the growth of Internet traffic and impose stringent requirements to datacenter operators for keeping pace with the increasing bandwidth and low-latency demands. At the same time, datacenters suffer from increasing number of interconnections dictating the deployment of novel architectures and high-radix switches. The ratification of 400 GbE standard is driving the market of optical transceivers nevertheless, a technology upgrade will be soon necessary to meet the tremendous traffic growth. In this paper, we present the development of 800 Gb/s and 1Tb/s optical transceivers migrating to 100 Gbaud per lane and employing wafer-scale bonding of InP membranes and InP-DHBT electronics as well as advanced co-packaging schemes. The InP membrane platform is also exploited for the development of novel ultra-fast optical space switches based on a modular architecture design for scaling to large number of I/O ports.Show less >
Language :
Anglais
Peer reviewed article :
Oui
Audience :
Internationale
Popular science :
Non
Source :
Submission date :
2023-12-01T03:29:12Z