Impact of Gate Drain Spacing on Low-Frequency ...
Document type :
Compte-rendu et recension critique d'ouvrage
DOI :
Title :
Impact of Gate Drain Spacing on Low-Frequency Noise Performance of In Situ SiN Passivated InAlGaN/GaN MIS-HEMTs
Author(s) :
Rzin, Mehdi [Auteur]
Equipe Electronique - Laboratoire GREYC - UMR6072
Routoure, Jean-Marc [Auteur]
Equipe Electronique - Laboratoire GREYC - UMR6072
Guillet, Bruno [Auteur]
Equipe Electronique - Laboratoire GREYC - UMR6072
Méchin, Laurence [Auteur]
Equipe Electronique - Laboratoire GREYC - UMR6072
Morales, Magali [Auteur]
Centre de recherche sur les Ions, les MAtériaux et la Photonique [CIMAP - UMR 6252]
Lacam, Cédric [Auteur]
Alcatel-Thales III-V Lab [III-V Lab]
Gamarra, Piero [Auteur]
Alcatel-Thales III-V Lab [III-V Lab]
Ruterana, Pierre [Auteur]
Centre de recherche sur les Ions, les MAtériaux et la Photonique [CIMAP - UMR 6252]
Medjdoub, Farid [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Equipe Electronique - Laboratoire GREYC - UMR6072
Routoure, Jean-Marc [Auteur]
Equipe Electronique - Laboratoire GREYC - UMR6072
Guillet, Bruno [Auteur]
Equipe Electronique - Laboratoire GREYC - UMR6072
Méchin, Laurence [Auteur]
Equipe Electronique - Laboratoire GREYC - UMR6072
Morales, Magali [Auteur]
Centre de recherche sur les Ions, les MAtériaux et la Photonique [CIMAP - UMR 6252]
Lacam, Cédric [Auteur]
Alcatel-Thales III-V Lab [III-V Lab]
Gamarra, Piero [Auteur]
Alcatel-Thales III-V Lab [III-V Lab]
Ruterana, Pierre [Auteur]
Centre de recherche sur les Ions, les MAtériaux et la Photonique [CIMAP - UMR 6252]
Medjdoub, Farid [Auteur]

Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Journal title :
IEEE Transactions on Electron Devices
Pages :
2820-2825
Publisher :
Institute of Electrical and Electronics Engineers
Publication date :
2017
ISSN :
0018-9383
English keyword(s) :
Channel resistance
gate–drain spacing
in situ sin passivation
InAlGaN/GaN
low-frequency noise (LFN)
metal–insulator–semiconductor high electron mobility transistor (MIS-HEMT).
gate–drain spacing
in situ sin passivation
InAlGaN/GaN
low-frequency noise (LFN)
metal–insulator–semiconductor high electron mobility transistor (MIS-HEMT).
HAL domain(s) :
Sciences de l'ingénieur [physics]/Electronique
English abstract : [en]
In this paper we investigated the gate–drain access region spacing (L GD) effect on electrical and noise performance of InAlGaN/GaN metal– insulator–semiconductor high electron mobility transistors (MIS-HEMTs) using in ...
Show more >In this paper we investigated the gate–drain access region spacing (L GD) effect on electrical and noise performance of InAlGaN/GaN metal– insulator–semiconductor high electron mobility transistors (MIS-HEMTs) using in situ SiN cap layer as gate insulator. Different L GD of InAlGaN/GaN MIS-HEMTs using sub-10 nm barrier layer are studied. Low-frequency noise measurements have been carried out for the first time in order to analyze the impact of the gate–drain spacing on the electrical characteristics. The noise of the channel under the gate has been identified as the dominant channel noise source for L GD < 10 μm. Finally, the calculated Hooge parameter (α H) is equal to 3.1 × 10 −4. It reflects the high material quality while using sub-10 nm InAlGaN layer, which is promising for high-frequency applications.Show less >
Show more >In this paper we investigated the gate–drain access region spacing (L GD) effect on electrical and noise performance of InAlGaN/GaN metal– insulator–semiconductor high electron mobility transistors (MIS-HEMTs) using in situ SiN cap layer as gate insulator. Different L GD of InAlGaN/GaN MIS-HEMTs using sub-10 nm barrier layer are studied. Low-frequency noise measurements have been carried out for the first time in order to analyze the impact of the gate–drain spacing on the electrical characteristics. The noise of the channel under the gate has been identified as the dominant channel noise source for L GD < 10 μm. Finally, the calculated Hooge parameter (α H) is equal to 3.1 × 10 −4. It reflects the high material quality while using sub-10 nm InAlGaN layer, which is promising for high-frequency applications.Show less >
Language :
Anglais
Popular science :
Non
ANR Project :
Source :
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