Titre :

Fabrication and characterization of half-Kerfed LiNbO3-based high-frequency (>100MHz) ultrasonic array transducers

Auteur(s) :

Zhang, Jin-Ying [Auteur]
Xu, Wei Jiang [Auteur]
Carlier, Julien [Auteur]
Matériaux et Acoustiques pour MIcro et NAno systèmes intégrés - IEMN [MAMINA - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Ji, X.M. [Auteur]
Nongaillard, Bertrand [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Queste, S. [Auteur]
Zhou, J. [Auteur]
Huang, Y.P. [Auteur]

Titre de la manifestation scientifique :

IEEE International Ultrasonics Symposium, IUS 2011

Ville :

Orlando, FL

Pays :

Etats-Unis d'Amérique

Date de début de la manifestation scientifique :

2011

Date de publication :

2011

Mot(s)-clé(s) en anglais :

is employed to simulate the properties of acoustic field and to calculate the electrical properties of the arrays
including crosstalk effect and electrical impedance. Furthermore
Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO 3 ) crystals and the limitation of etching aspect ratio is studied. Several arrays with different profiles are realized under optimized processes. At last
arrays with different pitches are fabricated and characterized by a network analyzer.
The effect of kerf depth is investigated on the performances of array transducers. A finite element tool
COMSOL

Discipline(s) HAL :

Sciences de l'ingénieur [physics]

Résumé en anglais : [en]

The effect of kerf depth is investigated on the performances of array transducers. A finite element tool, COMSOL, is employed to simulate the properties of acoustic field and to calculate the electrical properties of the ...
Lire la suite >The effect of kerf depth is investigated on the performances of array transducers. A finite element tool, COMSOL, is employed to simulate the properties of acoustic field and to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. Furthermore, Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO 3 ) crystals and the limitation of etching aspect ratio is studied. Several arrays with different profiles are realized under optimized processes. At last, arrays with different pitches are fabricated and characterized by a network analyzer.Lire moins >

Langue :

Anglais

Comité de lecture :

Oui

Audience :

Non spécifiée

Vulgarisation :

Non

Collections :

• Institut d'Électronique, de Microélectronique et de Nanotechnologie (IEMN) - UMR 8520

Source :

Harvested from HAL