Inductive effects on crosstalk evaluation
Document type :
Communication dans un congrès avec actes
DOI :
Title :
Inductive effects on crosstalk evaluation
Author(s) :
Servel, Gregory [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Huret, Fabrice [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Paleczny, Erick [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Legier, Jean-François [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Deschacht, Denis [Auteur]
Conception et Test de Systèmes MICroélectroniques [SysMIC]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Huret, Fabrice [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Paleczny, Erick [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Legier, Jean-François [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Deschacht, Denis [Auteur]
Conception et Test de Systèmes MICroélectroniques [SysMIC]
Conference title :
ITC: Interconnect Technology Conference
City :
Burlingame, CA
Country :
Etats-Unis d'Amérique
Start date of the conference :
2002-06-06
Book title :
International Interconnect Technology Conference
Publisher :
IEEE
Publication date :
2001
HAL domain(s) :
Sciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique
English abstract : [en]
Coupling noise between adjacent interconnect lines has become more significant in deep submicron technologies. From an electromagnetic analysis, this coupling noise is determined with respect to the different parameters ...
Show more >Coupling noise between adjacent interconnect lines has become more significant in deep submicron technologies. From an electromagnetic analysis, this coupling noise is determined with respect to the different parameters and a comparison is made between distributed RC and RLC models to represent the interconnection. It is shown that the inductive effects cannot be neglected and a corrective term is proposed to improve the accuracy of the RC model. Our analytical expression is validated through the different parameters involved.Show less >
Show more >Coupling noise between adjacent interconnect lines has become more significant in deep submicron technologies. From an electromagnetic analysis, this coupling noise is determined with respect to the different parameters and a comparison is made between distributed RC and RLC models to represent the interconnection. It is shown that the inductive effects cannot be neglected and a corrective term is proposed to improve the accuracy of the RC model. Our analytical expression is validated through the different parameters involved.Show less >
Language :
Anglais
Peer reviewed article :
Oui
Audience :
Internationale
Popular science :
Non
Source :