Title :

Wash Analyses of Flexible and Wearable Printed Circuits for E-Textiles and Their Prediction of Damages

Author(s) :

Zaman, Shahood Uz [Auteur]
Génie des Matériaux Textiles - ULR 2461 [GEMTEX]
École nationale supérieure des arts et industries textiles [ENSAIT]
Tao, Xuyuan [Auteur]
Génie des Matériaux Textiles - ULR 2461 [GEMTEX]
École nationale supérieure des arts et industries textiles [ENSAIT]
Cochrane, Cédric [Auteur]
Génie des Matériaux Textiles - ULR 2461 [GEMTEX]
École nationale supérieure des arts et industries textiles [ENSAIT]
Koncar, Vladan [Auteur]
Génie des Matériaux Textiles - ULR 2461 [GEMTEX]
École nationale supérieure des arts et industries textiles [ENSAIT]

Journal title :

Electronics

Abbreviated title :

Electronics

Volume number :

10

Pages :

-

Publication date :

2021-06-23

ISSN :

2079-9292

English keyword(s) :

wash damages
wash analysis
flexible printed circuits
e-textile

HAL domain(s) :

Sciences de l'ingénieur [physics]

English abstract : [en]

The development of specific user-based wearable smart textiles is gaining interest. The reliability and washability of e-textiles, especially electronic-based components of e-textiles, are under particular investigation ...
Show more >The development of specific user-based wearable smart textiles is gaining interest. The reliability and washability of e-textiles, especially electronic-based components of e-textiles, are under particular investigation nowadays. This is because e-textiles cannot be washed like normal textile products and washing electronic products is not common practice in our daily life. To adopt the e-textile products in our daily life, new standards, based on product usage, should be developed especially for flexibility and washability. The wearable motherboards are the main component for e-textile systems. They should be washing reliable and flexible for better adoption in the system. In this manuscript, flexible wearable PCBs were prepared with different conductive track widths and protected with silicone coatings. The samples were washed for 50 washing cycles in the household washing machine, and provoked damages were investigated. The PCBs were also investigated for bending tests (simulating mechanical stresses in the washing machine), and resultant damages were discussed and co-related with washing damages. The bending test was performed by bending the FPCBs at 90° over the circular rod and under the known hanging load.Show less >

Language :

Anglais

Peer reviewed article :

Oui

Audience :

Internationale

Popular science :

Non

Administrative institution(s) :

Université de Lille
ENSAIT
Junia HEI

Collections :

• Génie des matériaux textiles (GEMTEX) - ULR 2641

Submission date :

2023-06-20T11:50:30Z
2024-03-21T08:58:17Z