Composite selection for electronic packaging: case study and software development

Deplancke, Tiana; Bormann, T.; Salvo, Luc; Bréchet, Yves

Type de document :

Communication dans un congrès avec actes

URL permanente :

http://hdl.handle.net/20.500.12210/18122

Titre :

Composite selection for electronic packaging: case study and software development

Auteur(s) :

Deplancke, Tiana [Auteur]

Science et Ingénierie des Matériaux et Procédés [SIMaP]
Bormann, T. [Auteur]
Salvo, Luc [Auteur]
Science et Ingénierie des Matériaux et Procédés [SIMaP]
Bréchet, Yves [Auteur]
Science et Ingénierie des Matériaux et Procédés [SIMaP]

Titre de la manifestation scientifique :

9th International Materials Education Symposium

Ville :

Cambridge

Pays :

Royaume-Uni

Date de début de la manifestation scientifique :

2017-04-06

Discipline(s) HAL :

Chimie/Matériaux
Chimie/Polymères

Résumé en anglais : [en]

Electronic packaging in aeronautics are for the moment made in aluminium parts with pins. The set of requirements of such components require of course to extract heat from electronic device but also some electronic shielding ...
Lire la suite >Electronic packaging in aeronautics are for the moment made in aluminium parts with pins. The set of requirements of such components require of course to extract heat from electronic device but also some electronic shielding as well as good behavior to vibrations. A general materials selection analysis using classical tools as CES indicate that composite materials could be good candidates to reduce weight of these components. The real set of requirements are given in terms of maximum temperature of the packaging and thus require a more detail analysis related to the shape of the component and composite architecture and material selection. Such an analysis is difficult to perform using CES for the moment so to answer to this problem a specific methodology was employed: • Numerical simulation using COMSOL have been performed to obtained meta-model giving the maximum temperature of the packaging as a function of electronic power, heat exchange coefficient, thickness of packaging and composite thermal conductivities in the 3 directions. • A specific tool written with MATLAB has been developed in order to be able to import these meta models and to perform easily a composite selection that allow to select the matrix, the volume fraction, the reinforcement as well as geometrical characteristic of the component. The methodology and the tool developed could be used in many kind of applications and are complementary to CES software. Furthermore this tool can be easily extent to other architectural structures such as sandwiches, foams, multilayer...Lire moins >

Langue :

Anglais

Audience :

Internationale

Vulgarisation :

Non

Établissement(s) :

Université de Lille
CNRS
INRA
ENSCL

Collections :

Autres travaux scientifiques

Date de dépôt :

2020-02-03T14:42:23Z
2020-02-04T08:25:36Z
2020-02-28T10:28:40Z

Historique des modifications

Numéro de version	Lien	Date de modification
3	20.500.12210/18122*	2020-02-28T10:24:20Z
2	20.500.12210/18122.2	2020-02-04T08:23:44Z
1	20.500.12210/18122.1	2020-02-03T14:42:23Z

*Version sélectionnée

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