Composite selection for electronic packaging: case study and software development

Deplancke, Tiana; Bormann, T.; Salvo, Luc; Bréchet, Yves

Document type :

Communication dans un congrès avec actes

Permalink :

http://hdl.handle.net/20.500.12210/18122

Title :

Composite selection for electronic packaging: case study and software development

Author(s) :

Deplancke, Tiana [Auteur]

Science et Ingénierie des Matériaux et Procédés [SIMaP]
Bormann, T. [Auteur]
Salvo, Luc [Auteur]
Science et Ingénierie des Matériaux et Procédés [SIMaP]
Bréchet, Yves [Auteur]
Science et Ingénierie des Matériaux et Procédés [SIMaP]

Conference title :

9th International Materials Education Symposium

City :

Cambridge

Country :

Royaume-Uni

Start date of the conference :

2017-04-06

HAL domain(s) :

Chimie/Matériaux
Chimie/Polymères

English abstract : [en]

Electronic packaging in aeronautics are for the moment made in aluminium parts with pins. The set of requirements of such components require of course to extract heat from electronic device but also some electronic shielding ...
Show more >Electronic packaging in aeronautics are for the moment made in aluminium parts with pins. The set of requirements of such components require of course to extract heat from electronic device but also some electronic shielding as well as good behavior to vibrations. A general materials selection analysis using classical tools as CES indicate that composite materials could be good candidates to reduce weight of these components. The real set of requirements are given in terms of maximum temperature of the packaging and thus require a more detail analysis related to the shape of the component and composite architecture and material selection. Such an analysis is difficult to perform using CES for the moment so to answer to this problem a specific methodology was employed: • Numerical simulation using COMSOL have been performed to obtained meta-model giving the maximum temperature of the packaging as a function of electronic power, heat exchange coefficient, thickness of packaging and composite thermal conductivities in the 3 directions. • A specific tool written with MATLAB has been developed in order to be able to import these meta models and to perform easily a composite selection that allow to select the matrix, the volume fraction, the reinforcement as well as geometrical characteristic of the component. The methodology and the tool developed could be used in many kind of applications and are complementary to CES software. Furthermore this tool can be easily extent to other architectural structures such as sandwiches, foams, multilayer...Show less >

Language :

Anglais

Audience :

Internationale

Popular science :

Non

Administrative institution(s) :

Université de Lille
CNRS
INRA
ENSCL

Collections :

Autres travaux scientifiques

Submission date :

2020-02-03T14:42:23Z
2020-02-04T08:25:36Z
2020-02-28T10:28:40Z

Version	Link	Modification date
3	20.500.12210/18122*	2020-02-28T10:24:20Z
2	20.500.12210/18122.2	2020-02-04T08:23:44Z
1	20.500.12210/18122.1	2020-02-03T14:42:23Z

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Composite selection for electronic packaging: ...

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Excel

RIS