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Now showing items 1-10 of 71
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Radio-frequency and low noise characteristics of SOI technology on plastic for flexible electronics
Solid-State Electronics, Elsevier, 2013, 90, 73-78Compte-rendu et recension critique d'ouvragefulltext
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PEDOT:PSS-based micromuscles and microsensors fully integrated in flexible chips
Smart Materials and Structures, IOP Publishing, 01-09-2020, 29; 9, 09LT01Compte-rendu et recension critique d'ouvragefulltext
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Optimization of deep rib high speed phase modulators on 300mm industrial Si-photonics platform
SPIE Photonics Europe, Conference 11364 - Applications of Photonic Technology - Integrated Photonics Platforms: Fundamental Research, Manufacturing and Applications, Strasbourg, 06-04-2020, Proc. SPIE - Proceedings of SPIE, the International Society for Optical Engineering, SPIE, 14-02-2020Communication dans un congrès avec actesfulltext
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Linear Finite-Difference Bond Graph Model of an Ionic Polymer Actuator
Smart Materials and Structures, IOP Publishing, 09-2017, 26; 9, 095055Compte-rendu et recension critique d'ouvragefulltext
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Poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate)/polyethylene oxide electrodes with improved electrical and electrochemical properties for soft microactuators and microsensors
Advanced Electronic Materials, Wiley, 04-2019, 5; 4, 1800948Compte-rendu et recension critique d'ouvragefulltext
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Cracking effects in squashable and stretchable thin metal films on PDMS for flexible microsystems and electronics
Scientific Reports, Nature Publishing Group, 22-06-2018, 8; 1Compte-rendu et recension critique d'ouvragefulltext
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The good, the bad and the ugly polishing: Effect of abrasive size on standardless EDS analysis of Portland cement clinker's calcium silicates
Micron, Elsevier, 07-2022, 158, 103266Article dans une revue scientifiquefulltext
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Demonstrating full integration process for electroactive polymer microtransducers to realize soft microchips
33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, 18-01-2020, 33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS), IEEE, 2020Communication dans un congrès avec actesfulltext
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V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology
IEEE Microwave and Wireless Components Letters, Institute of Electrical and Electronics Engineers, 2015, 25; 7, 436-438Compte-rendu et recension critique d'ouvrage -
Device for light-matter interaction enhancement in the full THz range for precise spectroscopy of small volume samples
2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2018), Nagoya, 09-09-2018, IRMMW-THz 2018, Nagoya, Japan, september 9-14, 2018, paper Tu-POS-05, 2 pages, ISBN 978-1-5386-3810-1 ; e-ISBN 978-1-5386-3809-5, doi: 10.1109/IRMMW-THz.2018.8510508 (2018), IEEE, 14-09-2018Communication dans un congrès avec actes