Thin-film adhesion characterization by Colored Picosecond Acoustics

Devos, Arnaud; Emery, P.

Type de document :

Compte-rendu et recension critique d'ouvrage

DOI :

10.1016/j.surfcoat.2018.07.097

Titre :

Thin-film adhesion characterization by Colored Picosecond Acoustics

Auteur(s) :

Devos, Arnaud [Auteur correspondant]

Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Physique - IEMN [PHYSIQUE - IEMN]
Emery, P. [Auteur]

Titre de la revue :

Surface and Coatings Technology

Pagination :

406-410

Éditeur :

Elsevier

Date de publication :

2018

ISSN :

0257-8972

Mot(s)-clé(s) en anglais :

Adhesion
Thin film
Thickness
Ultrafast acoustics

Discipline(s) HAL :

Sciences de l'ingénieur [physics]

Résumé en anglais : [en]

This paper presents some applications of a recent technique so-called the Colored Picosecond Acoustics (APiC) to the characterization of complex stacks of thin films. The technique is a unique combination of optics and ...
Lire la suite >This paper presents some applications of a recent technique so-called the Colored Picosecond Acoustics (APiC) to the characterization of complex stacks of thin films. The technique is a unique combination of optics and acoustics that implements an acoustic pulse-echo technique at the nanoscale using a tunable ultrafast laser. From the experimental point of view, it is a full optical setup, acoustics taking place in the sample only. Very high frequency acoustic waves (up to several hundreds of GHz) are emitted and detected using ultra-short laser pulses. The capabilities of the APiC technique are demonstrated on various thin-film samples made of metals, dielectrics and semiconductors. Ultra-high frequency acoustic waves are first used to assess the film thickness or to measure thin-film elasticity via the acoustic time-of-flight measurement. A great potential is the capability to detect adhesion defects at buried interface through an analysis of the acoustic reflection at the concerned interface. Acoustic mapping of the sample surface reveal, in non-destructive manner, weak points at the buried interface.Lire moins >

Langue :

Anglais

Vulgarisation :

Non

Collections :

Institut d'Électronique, de Microélectronique et de Nanotechnologie (IEMN) - UMR 8520

Source :

Harvested from HAL

Thin-film adhesion characterization by ... BibTeX CSV Excel RIS

Thin-film adhesion characterization by ...

BibTeX

CSV

Excel

RIS