Thermal management of electronic devices ...
Document type :
Communication dans un congrès avec actes
Title :
Thermal management of electronic devices by composite materials integrated in silicon
Author(s) :
Ollier, Emmanuel [Auteur correspondant]
Soupremanien, Ulrich [Auteur]
Remondière, Vincent [Auteur]
Dijon, Jean [Auteur]
Le Poche, Hélène [Auteur]
CEA Tech Nouvelle-Aquitaine [DNAQ]
Lefevre, F. [Auteur]
Centre de Thermique de Lyon [CETHIL]
Lips, S. [Auteur]
Centre de Thermique de Lyon [CETHIL]
Kinkelin, Christophe [Auteur]
Centre de Thermique de Lyon [CETHIL]
Rolland, Nathalie [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Rolland, Paul-Alain [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Zegaoui, Malek [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Lhostis, Sandrine [Auteur]
Ancey, Pascal [Auteur]
Descouts, Brigitte [Auteur]
Kaplan, Yann [Auteur]
Soupremanien, Ulrich [Auteur]
Remondière, Vincent [Auteur]
Dijon, Jean [Auteur]
Le Poche, Hélène [Auteur]
CEA Tech Nouvelle-Aquitaine [DNAQ]
Lefevre, F. [Auteur]
Centre de Thermique de Lyon [CETHIL]
Lips, S. [Auteur]
Centre de Thermique de Lyon [CETHIL]
Kinkelin, Christophe [Auteur]
Centre de Thermique de Lyon [CETHIL]
Rolland, Nathalie [Auteur]

Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Rolland, Paul-Alain [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Zegaoui, Malek [Auteur]

Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Lhostis, Sandrine [Auteur]
Ancey, Pascal [Auteur]
Descouts, Brigitte [Auteur]
Kaplan, Yann [Auteur]
Conference title :
Microtherm 2013 Microtechnology and Thermal Problems in Electronics
City :
Lodz
Country :
Pologne
Start date of the conference :
2013-06-25
Publication date :
2013
English keyword(s) :
phase change materials
carbon nanotubes
thermal management
Interposer
carbon nanotubes
thermal management
Interposer
HAL domain(s) :
Sciences de l'ingénieur [physics]/Mécanique [physics.med-ph]/Thermique [physics.class-ph]
English abstract : [en]
As the power of electronic systems powers is increasing, thermal fluxes are getting higher, up to more than 100W/cm2 in more critical cases. They result in hot spots with various consequences, especially performance reduction ...
Show more >As the power of electronic systems powers is increasing, thermal fluxes are getting higher, up to more than 100W/cm2 in more critical cases. They result in hot spots with various consequences, especially performance reduction and reliability issues. Most of the prior research has been focused on active liquid cooling and on reducing hot spots by the implementation of thermal interface materials (TIMs) and spreading solutions. The approach presented here is based on the implementation in silicon of nanocomposite structures including carbon nanotubes (CNTs) and phase change materials (PCMs).The simulation model presented here shows how the composite CNTs/PCM structure efficiently reduces the temperature increase at the silicon surface compared to the implementation of PCM only or thicker silicon. A fabrication process flow is presented with a special focus on the assembly of silicon top and bottom parts with CNTs. Process conditions are explored to insure mechanical adhesion and thermal contact quality. This thermal interposer concept provides a new solution for thermal management and reliability improvement of devices. It is of great interest for electronic and optical devices, MEMS and 3D integration.Show less >
Show more >As the power of electronic systems powers is increasing, thermal fluxes are getting higher, up to more than 100W/cm2 in more critical cases. They result in hot spots with various consequences, especially performance reduction and reliability issues. Most of the prior research has been focused on active liquid cooling and on reducing hot spots by the implementation of thermal interface materials (TIMs) and spreading solutions. The approach presented here is based on the implementation in silicon of nanocomposite structures including carbon nanotubes (CNTs) and phase change materials (PCMs).The simulation model presented here shows how the composite CNTs/PCM structure efficiently reduces the temperature increase at the silicon surface compared to the implementation of PCM only or thicker silicon. A fabrication process flow is presented with a special focus on the assembly of silicon top and bottom parts with CNTs. Process conditions are explored to insure mechanical adhesion and thermal contact quality. This thermal interposer concept provides a new solution for thermal management and reliability improvement of devices. It is of great interest for electronic and optical devices, MEMS and 3D integration.Show less >
Language :
Anglais
Peer reviewed article :
Oui
Audience :
Internationale
Popular science :
Non
Comment :
11 pages
Source :