Titre :

3D self-assembling of SU-8 microstructures on silicon by plasma induced compressive stress

Auteur(s) :

Bureau, Jean-Baptiste [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Legrand, Bernard [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Collard, Dominique [Auteur]
Buchaillot, Lionel [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]

Titre de la manifestation scientifique :

13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.

Ville :

Seoul

Pays :

Corée du Sud

Date de début de la manifestation scientifique :

2005-06-05

Titre de l’ouvrage :

Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS'05

Éditeur :

IEEE, Piscataway, NJ, USA

Date de publication :

2005

Mot(s)-clé(s) en anglais :

Microstructure
Silicon
Compressive stress
Plasma x-ray sources
Resists
Particle beams
Plasma applications
Plasma properties
Spectroscopy
Performance analysis

Discipline(s) HAL :

Sciences de l'ingénieur [physics]

Résumé en anglais : [en]

This paper presents the development of suspended movable microstructures made of SU-8 photoresist where compressive stress leads to 3D self-assembled microstructures. Internal compressive stress in the photoresist is induced ...
Lire la suite >This paper presents the development of suspended movable microstructures made of SU-8 photoresist where compressive stress leads to 3D self-assembled microstructures. Internal compressive stress in the photoresist is induced by an SF/sub 6/ based plasma process. Clamped-clamped beam structures have been fabricated to characterize the stress depending on the plasma duration and the lengths of the beams. A compressive stress of 48 MPa was calculated for a 3 minute plasma. X-ray photoelectron spectroscopy (XPS) analysis has been performed to characterize the surface of the structures. These mechanical properties could be used to make 3D self-assembled structures for applications in biological sciencesLire moins >

Langue :

Anglais

Comité de lecture :

Oui

Audience :

Internationale

Vulgarisation :

Non

Collections :

• Institut d'Électronique, de Microélectronique et de Nanotechnologie (IEMN) - UMR 8520

Source :

Harvested from HAL