220 GHz E-Plane Transition from Waveguide ...
Document type :
Communication dans un congrès avec actes
Title :
220 GHz E-Plane Transition from Waveguide to Suspended Stripline Integrated on Industrial Organic Laminate Substrate Technology
Author(s) :
Fiorese, Victor [Auteur correspondant]
Microélectronique Silicium - IEMN [MICROELEC SI - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
STMicroelectronics
Laporte, F. [Auteur]
STMicroelectronics
Caillet, J.F. [Auteur]
STMicroelectronics
Catalano, G. [Auteur]
STMicroelectronics
Gianesello, F. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Ducournau, Guillaume [Auteur]
Photonique THz - IEMN [PHOTONIQUE THZ - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Dubois, Emmanuel [Auteur]
Microélectronique Silicium - IEMN [MICROELEC SI - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Gaquière, Christophe [Auteur]
Puissance - IEMN [PUISSANCE - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Tricoteaux, B. [Auteur]
Werquin, M. [Auteur]
Gloria, D. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Microélectronique Silicium - IEMN [MICROELEC SI - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
STMicroelectronics
Laporte, F. [Auteur]
STMicroelectronics
Caillet, J.F. [Auteur]
STMicroelectronics
Catalano, G. [Auteur]
STMicroelectronics
Gianesello, F. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Ducournau, Guillaume [Auteur]

Photonique THz - IEMN [PHOTONIQUE THZ - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Dubois, Emmanuel [Auteur]
Microélectronique Silicium - IEMN [MICROELEC SI - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Gaquière, Christophe [Auteur]
Puissance - IEMN [PUISSANCE - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Tricoteaux, B. [Auteur]
Werquin, M. [Auteur]
Gloria, D. [Auteur]
STMicroelectronics [Crolles] [ST-CROLLES]
Conference title :
European Microwave Conference, EuMC 2021, Session EuMC06 - 3D to 2D Transitions and New Materials for mmWave system Integration
Conference organizers(s) :
EuMIC/EuMC/EuMW
City :
London
Country :
Royaume-Uni
Start date of the conference :
2021-04-02
Book title :
2021 51st European Microwave Conference (EuMC)
Publication date :
2021-06-02
English keyword(s) :
mmW
THz
E-plane transition
low-cost packaging
waveguide
organic laminate substrate
THz
E-plane transition
low-cost packaging
waveguide
organic laminate substrate
HAL domain(s) :
Sciences de l'ingénieur [physics]
English abstract : [en]
In this paper, an assessment up to 220 GHz of industrial organic laminate substrate technology to integrate millimeter-wave (mmW) waveguide to suspended stripline (SSL) transition is proposed. A WR5 waveguide transition ...
Show more >In this paper, an assessment up to 220 GHz of industrial organic laminate substrate technology to integrate millimeter-wave (mmW) waveguide to suspended stripline (SSL) transition is proposed. A WR5 waveguide transition has been manufactured and insertion loss (IL) of 1.4 dB @ 140 GHz and 4.2 dB @ 220 GHz has been achieved, competing with standard approach using a quartz substrate solution with III-V technology. This promising performance paves the way of cost effective mmW and sub-THz module manufacturing leveraging high volume manufacturing packaging processes developed for Si based technologies.Show less >
Show more >In this paper, an assessment up to 220 GHz of industrial organic laminate substrate technology to integrate millimeter-wave (mmW) waveguide to suspended stripline (SSL) transition is proposed. A WR5 waveguide transition has been manufactured and insertion loss (IL) of 1.4 dB @ 140 GHz and 4.2 dB @ 220 GHz has been achieved, competing with standard approach using a quartz substrate solution with III-V technology. This promising performance paves the way of cost effective mmW and sub-THz module manufacturing leveraging high volume manufacturing packaging processes developed for Si based technologies.Show less >
Language :
Anglais
Peer reviewed article :
Oui
Audience :
Internationale
Popular science :
Non
Source :
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