Project type
Now showing items 1-2 of 2
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Reliability-Aware Circuit Design Methodology for Beyond-5G Communication Systems
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 09-2017, 17; 3, 490 - 506Compte-rendu et recension critique d'ouvrage -
Scalable Modeling of Thermal Impedance in InP DHBTs Targeting Terahertz Applications
IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 05-2019, 66; 5, 2125-2131Compte-rendu et recension critique d'ouvragefulltext