Thin-film adhesion: a comparative study ...
Type de document :
Compte-rendu et recension critique d'ouvrage
Titre :
Thin-film adhesion: a comparative study between colored picosecond acoustics and spontaneous buckles analysis
Auteur(s) :
Devos, Arnaud [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Physique - IEMN [PHYSIQUE - IEMN]
Vital-Juarez, A. [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Chargui, A. [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Cordill, M.J. [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Physique - IEMN [PHYSIQUE - IEMN]
Vital-Juarez, A. [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Chargui, A. [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Cordill, M.J. [Auteur]
Titre de la revue :
Surface and Coatings Technology
Pagination :
127485
Éditeur :
Elsevier
Date de publication :
2021-09-15
ISSN :
0257-8972
Mot(s)-clé(s) en anglais :
adhesion
thin film
buckles
reflection coefficient
picosecond acoustics
thin film
buckles
reflection coefficient
picosecond acoustics
Discipline(s) HAL :
Sciences de l'ingénieur [physics]/Matériaux
Sciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique
Sciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique
Résumé en anglais : [en]
This paper presents some quantitative measurements of the adhesion energy of thin WTi films deposited on Si substrate. Two different techniques are applied to the same sample series. One is a mechanical test based on the ...
Lire la suite >This paper presents some quantitative measurements of the adhesion energy of thin WTi films deposited on Si substrate. Two different techniques are applied to the same sample series. One is a mechanical test based on the analysis of spontaneously formed defects. The second is based on acoustic waves whose reflection at the interface between the thin-film and the substrate is sensitive to the adhesion. An excellent correlation is obtained between both approaches: the adhesion energy measured by buckles analysis and acoustic reflection coefficient measured by picosecond acoustics. The acoustic approach offers several advantages among which a non-destructive character, a compatibility with complex stacks and a sensitivity to detect adhesion anomaly even if no defect is formed.Lire moins >
Lire la suite >This paper presents some quantitative measurements of the adhesion energy of thin WTi films deposited on Si substrate. Two different techniques are applied to the same sample series. One is a mechanical test based on the analysis of spontaneously formed defects. The second is based on acoustic waves whose reflection at the interface between the thin-film and the substrate is sensitive to the adhesion. An excellent correlation is obtained between both approaches: the adhesion energy measured by buckles analysis and acoustic reflection coefficient measured by picosecond acoustics. The acoustic approach offers several advantages among which a non-destructive character, a compatibility with complex stacks and a sensitivity to detect adhesion anomaly even if no defect is formed.Lire moins >
Langue :
Anglais
Vulgarisation :
Non
Source :
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