Towards High Performance Fully Vertical ...
Type de document :
Communication dans un congrès avec actes
Titre :
Towards High Performance Fully Vertical GaN-on-Silicon PIN Diodes
Auteur(s) :
Hamdaoui, Youssef [Auteur]
WIde baNd gap materials and Devices - IEMN [WIND - IEMN]
Abid, Idriss [Auteur]
WIde baNd gap materials and Devices - IEMN [WIND - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Michler, Sondre [Auteur]
Ziouche, Katir [Auteur]
WIde baNd gap materials and Devices - IEMN [WIND - IEMN]
Medjdoub, Farid [Auteur]
WIde baNd gap materials and Devices - IEMN [WIND - IEMN]
WIde baNd gap materials and Devices - IEMN [WIND - IEMN]
Abid, Idriss [Auteur]
WIde baNd gap materials and Devices - IEMN [WIND - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Michler, Sondre [Auteur]
Ziouche, Katir [Auteur]

WIde baNd gap materials and Devices - IEMN [WIND - IEMN]
Medjdoub, Farid [Auteur]

WIde baNd gap materials and Devices - IEMN [WIND - IEMN]
Titre de la manifestation scientifique :
Compound semiconductor week 2023
Ville :
Jeju
Pays :
Corée du Sud
Date de début de la manifestation scientifique :
2023-05-29
Titre de l’ouvrage :
Proceeding of CSW2023
Date de publication :
2023-05-29
Mot(s)-clé(s) en anglais :
Wide band gap semiconductor GaN-on-Si Vertical power devices
Wide band gap semiconductor
GaN-on-Si
Vertical power devices
Wide band gap semiconductor
GaN-on-Si
Vertical power devices
Discipline(s) HAL :
Sciences de l'ingénieur [physics]
Résumé en anglais : [en]
In this work, we demonstrate quasi and fully vertical PIN GaN on Si diodes with a low on state resistance of 0.35 mΩ.cm² and high average electric field of 1.82 MV/cm, which is favorably comparable to the state-of-the-art ...
Lire la suite >In this work, we demonstrate quasi and fully vertical PIN GaN on Si diodes with a low on state resistance of 0.35 mΩ.cm² and high average electric field of 1.82 MV/cm, which is favorably comparable to the state-of-the-art considering the absence of edge termination or field plates. The breakdown voltage scales well with the drift layer thickness of 3.5 µm and 4.5 µm resulting in hard breakdown values exceeding 800 V. The achieved results are promising towards kVolt-class fully vertical GaN-on-Silicon devices.Lire moins >
Lire la suite >In this work, we demonstrate quasi and fully vertical PIN GaN on Si diodes with a low on state resistance of 0.35 mΩ.cm² and high average electric field of 1.82 MV/cm, which is favorably comparable to the state-of-the-art considering the absence of edge termination or field plates. The breakdown voltage scales well with the drift layer thickness of 3.5 µm and 4.5 µm resulting in hard breakdown values exceeding 800 V. The achieved results are promising towards kVolt-class fully vertical GaN-on-Silicon devices.Lire moins >
Langue :
Anglais
Comité de lecture :
Oui
Audience :
Internationale
Vulgarisation :
Non
Projet Européen :
Source :
Fichiers
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- CSW-2023_Abstract_IEMN-Siltronic.pdf
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