Tunable Contact Angle Hysteresis for ...
Document type :
Compte-rendu et recension critique d'ouvrage
DOI :
Title :
Tunable Contact Angle Hysteresis for Component Placement on Stretchable Superhydrophobic Surfaces
Author(s) :
Balan, Catalin Mihai [Auteur]
Vlandas, Alexis [Auteur]
Bio-Micro-Electro-Mechanical Systems - IEMN [BIOMEMS - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Department of Materials
Senez, Vincent [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Vlandas, Alexis [Auteur]
Bio-Micro-Electro-Mechanical Systems - IEMN [BIOMEMS - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Department of Materials
Senez, Vincent [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Journal title :
Advanced Materials Interfaces
Pages :
1701353
Publisher :
Wiley
Publication date :
2018-06
ISSN :
2196-7350
English keyword(s) :
capillary self-placement
dynamic wettability
magnetic actuation
smart surfaces
stretchable superhydrophobic surfaces
dynamic wettability
magnetic actuation
smart surfaces
stretchable superhydrophobic surfaces
HAL domain(s) :
Sciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique
English abstract : [en]
One of the promising strategies to achieve high performance flexible electronics is to integrate high performance components (micro-electro-mechanical systems, integrated circuit, etc.) on a flexible substrate. The ...
Show more >One of the promising strategies to achieve high performance flexible electronics is to integrate high performance components (micro-electro-mechanical systems, integrated circuit, etc.) on a flexible substrate. The heterointegration of fragile high performance components, for example, thinned down 100 GHz silicon technology, necessitate however methodologies to place these components on the substrate while exerting as little force as possible to prevent any damage from occurring. In this work, a novel approach is presented for component positioning by capillary assembly on a smart flexible substrate composed of two layers of polymers. It is shown how the wettability of the surface can be engineered by combining stretching induced deformation of the top layer with plasma treatment. Using magnetically actuated ferrofluid droplets which carry the silicon chip shows how it can be aligned and deposited at predetermined sites on these substrates. It is demonstrated that unlike standard capillary alignment which relies on a hydrophobic/hydrophilic contrast, in this case deposition is controlled by surface adhesion contrast between the site and the rest of the substrate. Furthermore, it is explained how deposition sites can be selectively activated through localized stretching thus producing generic smart substrates on which precise depositions sites can be activated according to the needs of the end user.Show less >
Show more >One of the promising strategies to achieve high performance flexible electronics is to integrate high performance components (micro-electro-mechanical systems, integrated circuit, etc.) on a flexible substrate. The heterointegration of fragile high performance components, for example, thinned down 100 GHz silicon technology, necessitate however methodologies to place these components on the substrate while exerting as little force as possible to prevent any damage from occurring. In this work, a novel approach is presented for component positioning by capillary assembly on a smart flexible substrate composed of two layers of polymers. It is shown how the wettability of the surface can be engineered by combining stretching induced deformation of the top layer with plasma treatment. Using magnetically actuated ferrofluid droplets which carry the silicon chip shows how it can be aligned and deposited at predetermined sites on these substrates. It is demonstrated that unlike standard capillary alignment which relies on a hydrophobic/hydrophilic contrast, in this case deposition is controlled by surface adhesion contrast between the site and the rest of the substrate. Furthermore, it is explained how deposition sites can be selectively activated through localized stretching thus producing generic smart substrates on which precise depositions sites can be activated according to the needs of the end user.Show less >
Language :
Anglais
Popular science :
Non
Source :
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