A LiNbO3 ultrasonic phased array transducer ...
Type de document :
Communication dans un congrès avec actes
DOI :
Titre :
A LiNbO3 ultrasonic phased array transducer of more than 100 MHz
Auteur(s) :
Xu, Wei Jiang [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Ji, X.M. [Auteur]
Zhang, Jin-Ying [Auteur]
Carlier, Julien [Auteur]
Matériaux et Acoustiques pour MIcro et NAno systèmes intégrés - IEMN [MAMINA - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Nongaillard, Bertrand [Auteur]
Queste, S. [Auteur]
Huang, Y.P. [Auteur]
Piwakowski, Bogdan [Auteur]

Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Ji, X.M. [Auteur]
Zhang, Jin-Ying [Auteur]
Carlier, Julien [Auteur]

Matériaux et Acoustiques pour MIcro et NAno systèmes intégrés - IEMN [MAMINA - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Nongaillard, Bertrand [Auteur]

Queste, S. [Auteur]
Huang, Y.P. [Auteur]
Piwakowski, Bogdan [Auteur]

Titre de la manifestation scientifique :
International Congress on Ultrasonics, ICU 2011
Ville :
Gdansk
Pays :
Pologne
Date de début de la manifestation scientifique :
2011
Date de publication :
2011
Discipline(s) HAL :
Sciences de l'ingénieur [physics]
Résumé en anglais : [en]
High-frequency ultrasonic transducer arrays are essential for high resolution imaging in clinical analysis and Non-Destructive Evaluation (NDE). However, the structure design and fabrication of the kerfed ultrasonic array ...
Lire la suite >High-frequency ultrasonic transducer arrays are essential for high resolution imaging in clinical analysis and Non-Destructive Evaluation (NDE). However, the structure design and fabrication of the kerfed ultrasonic array is quite challenging when very high frequency (≥ 100 MHz) is required. Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO3) crystals. Furthermore, a finite element tool, COMSOL, is employed to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. At last, arrays with a pitch of 40 μm are fabricated and characterized by a network analyzer. The measured results agree well with the theoretical predictions.Lire moins >
Lire la suite >High-frequency ultrasonic transducer arrays are essential for high resolution imaging in clinical analysis and Non-Destructive Evaluation (NDE). However, the structure design and fabrication of the kerfed ultrasonic array is quite challenging when very high frequency (≥ 100 MHz) is required. Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO3) crystals. Furthermore, a finite element tool, COMSOL, is employed to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. At last, arrays with a pitch of 40 μm are fabricated and characterized by a network analyzer. The measured results agree well with the theoretical predictions.Lire moins >
Langue :
Anglais
Comité de lecture :
Oui
Audience :
Non spécifiée
Vulgarisation :
Non
Source :