Titre :

Colored Picosecond Acoustics Versus Scotch Tape Adhesion Test: Confrontation on a Series of Similar Samples With a Variable Adhesion

Auteur(s) :

Juarez, Alejandro Vital [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Roffi, Laureline [Auteur]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Desmarres, Jean-Michel [Auteur]
Centre National d'Études Spatiales [Toulouse] [CNES]
Devos, Arnaud [Auteur correspondant]
Physique - IEMN [PHYSIQUE - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]

Titre de la manifestation scientifique :

International Conference on Metallurgical Coatings and Thin Films, ICMCTF 2022, Session E2-1-ThM: Mechanical Properties and Adhesion

Ville :

San Diego

Pays :

Etats-Unis d'Amérique

Date de début de la manifestation scientifique :

2022-05-22

Discipline(s) HAL :

Sciences de l'ingénieur [physics]

Résumé en anglais : [en]

The study of the bonding at interfaces between thin layers is of great importance in optical and electronic applications as well as in the field of space exploration. A large number of methods have been developed to ...
Lire la suite >The study of the bonding at interfaces between thin layers is of great importance in optical and electronic applications as well as in the field of space exploration. A large number of methods have been developed to characterize the adhesion of a thin film to a substrate. Among them, Scotch Tape test is still one of the most popular methods.Acoustic waves and especially ultra-high frequency acoustic waves are also sensitive to adhesion defects as they affect the way acoustic waves are reflected at the concerned interface.In this paper, we prepare a dedicated series of identical thin-film samples with a variable adhesion at the interface between the film and its substrate. For that several avenues have been explored: introduction of a weak layer between the film and the substrate; reinforcement of the weak layer adhesion using ion beam implantation. The samples are then characterized using two much different techniques: colored picosecond acoustics for measuring thickness and acoustic reflection coefficient at the interface and scotch tape test to have an independent evaluation of the adhesion. An excellent correlation is found between techniques regarding adhesion that confirms the capability of APiC to perform adhesion test in a totally non destuctive manner and furthermore locally.Lire moins >

Langue :

Anglais

Comité de lecture :

Oui

Audience :

Internationale

Vulgarisation :

Non

Collections :

• Institut d'Électronique, de Microélectronique et de Nanotechnologie (IEMN) - UMR 8520

Source :

Harvested from HAL