Three-in-one ITO-Cu-ITO based backplane circuit strategy for micro-LED display

Pei, Jingxuan; Zhang, Zhiqiang; Yu, Xiang; Yang, Lei; Zhang, Jing; Boukherroub, Rabah; Liu, Yayun

Type de document :

Compte-rendu et recension critique d'ouvrage

DOI :

10.1016/j.compositesa.2022.107330

Titre :

Three-in-one ITO-Cu-ITO based backplane circuit strategy for micro-LED display

Auteur(s) :

Pei, Jingxuan [Auteur]
China University of Geosciences [Beijing]
Zhang, Zhiqiang [Auteur]
China University of Geosciences [Beijing]
Shandong Academy of Sciences [SDAS]
Yu, Xiang [Auteur]
China University of Geosciences [Beijing]
Yang, Lei [Auteur]
Groupe Sociétés, Religions, Laïcités [GSRL]
Zhang, Jing [Auteur]
Boukherroub, Rabah [Auteur]

NanoBioInterfaces - IEMN [NBI - IEMN]
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 [IEMN]
Liu, Yayun [Auteur]
University of Chinese Academy of Sciences [Beijing] [UCAS]

Titre de la revue :

Composites Part A: Applied Science and Manufacturing

Pagination :

107330

Éditeur :

Elsevier

Date de publication :

2023-02

ISSN :

1359-835X

Discipline(s) HAL :

Sciences de l'ingénieur [physics]

Résumé en anglais : [en]

A three-in-one ITO-Cu-ITO multilayer wire strategy is developed to reliably fabricate large-size backplane circuit for micro-LED display. The multilayered wire was prepared by magnetron sputtering and electroplating, and ...
Lire la suite >A three-in-one ITO-Cu-ITO multilayer wire strategy is developed to reliably fabricate large-size backplane circuit for micro-LED display. The multilayered wire was prepared by magnetron sputtering and electroplating, and presented a sandwich structure of ITOtransitional layer /Cuseed layer /Cuelectroplating layer/ITOpassivation layer. Synergistic effect among the sandwiched layers endowed the coated wire with good electrical performance (2.31 × 10-3 Ω/sq), favorable adhesion (5B degree) and superior thickness uniformity (8 %), and could ensure reliable machining of glass-based backplane circuit. The fabricated multilayer wire facilitated the development of micro-LED backplane circuit, and was applicable to synthesize large-size (1.1 * 1.3 m2) glass backplane circuit. Field test of micro-LED circuit assembly proved the feasibility of the proposed backplane circuit strategy in production line. It is rational to believe that our strategy may offer a good avenue to upgrade traditional ITO and Cu materials for developing high-performance displays in scale production.Lire moins >

Langue :

Anglais

Vulgarisation :

Non

Collections :

Institut d'Électronique, de Microélectronique et de Nanotechnologie (IEMN) - UMR 8520

Source :

Harvested from HAL

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