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Improved performance of flexible CMOS technology using ultimate thinning and transfer bonding
6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-09-2016, 6th Electronic System-Integration Technology Conference (ESTC), IEEE, 2016Communication dans un congrès avec actes -
Trilayer conducting polymer transduction: device physics, modeling, and simulation
SPIE Smart Structures + Nondestructive Evaluation, Conference 11587 - Electroactive Polymer Actuators and Devices XXIII, EAPAD 2021, Online Only, 22-03-2021, Proceedings of the SPIE - International Society for Optical Engineering, SPIE, 03-2021Communication dans un congrès avec actes -
Optimization of laser manufacturing conditions to improve lubricant retention of slippery liquid-infused surface
4èmes journées plénières GDR B2i 2021, Toulouse, 21-09-2021 -
V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology
IEEE Microwave and Wireless Components Letters, Institute of Electrical and Electronics Engineers, 2015, 25; 7, 436-438Compte-rendu et recension critique d'ouvrage -
Realization of a 2.45 GHz microstrip bandpass filter on a flexible cellulose-based material
2021 International Conference on Green Energy, Computing and Sustainable Technology (GECOST), Miri, 07-07-2021, IEEE, 2021Communication dans un congrès avec actes -
Ultra-hydrophobic biomimetic transparent bilayer thin film deposited by atmospheric pressure plasma
Surfaces and Interfaces, Elsevier, 11-2023, 42, part ACompte-rendu et recension critique d'ouvrage -
Device for light-matter interaction enhancement in the full THz range for precise spectroscopy of small volume samples
2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2018), Nagoya, 09-09-2018, IRMMW-THz 2018, Nagoya, Japan, september 9-14, 2018, paper Tu-POS-05, 2 pages, ISBN 978-1-5386-3810-1 ; e-ISBN 978-1-5386-3809-5, doi: 10.1109/IRMMW-THz.2018.8510508 (2018), IEEE, 14-09-2018Communication dans un congrès avec actes -
Recent improvements of flexible GaN-based HEMT technology
physica status solidi (a), Wiley, 04-2017, 214; 4, 1600484, 5 pagesCompte-rendu et recension critique d'ouvrage -
Femtosecond pulsed laser for advanced photonic packaging
7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, 18-09-2018Communication dans un congrès avec actes -
[Invited] Packaging fonctionnel de fonctions RF, mmW et photonique basé sur le micro-usinage laser
9eme Conférence plénière du GdR Ondes, Villeneuve d'Ascq, 30-11-2021Communication dans un congrès avec actes