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V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology
IEEE Microwave and Wireless Components Letters, Institute of Electrical and Electronics Engineers, 2015, 25; 7, 436-438Compte-rendu et recension critique d'ouvrage -
Device for light-matter interaction enhancement in the full THz range for precise spectroscopy of small volume samples
2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2018), Nagoya, 09-09-2018, IRMMW-THz 2018, Nagoya, Japan, september 9-14, 2018, paper Tu-POS-05, 2 pages, ISBN 978-1-5386-3810-1 ; e-ISBN 978-1-5386-3809-5, doi: 10.1109/IRMMW-THz.2018.8510508 (2018), IEEE, 14-09-2018Communication dans un congrès avec actes -
Recent improvements of flexible GaN-based HEMT technology
physica status solidi (a), Wiley, 04-2017, 214; 4, 1600484, 5 pagesCompte-rendu et recension critique d'ouvrage -
Femtosecond pulsed laser for advanced photonic packaging
7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, 18-09-2018Communication dans un congrès avec actes -
Modeling and parameter retrieving in time domain spectroscopy of material and metamaterial
Nonlinear Optics and its Applications, Strasbourg, 22-04-2018, SPIECommunication dans un congrès avec actes -
Single mode polymer optical waveguides and out-of-plane coupling structure on a glass substrate
7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, 18-09-2018Communication dans un congrès avec actes -
150-GHz RF SOI-CMOS technology in ultrathin regime on organic substrate
IEEE Electron Device Letters, Institute of Electrical and Electronics Engineers, 2011, 32, 1510-1512Compte-rendu et recension critique d'ouvrage -
Fabrication, characterization, and physical analysis of AlGaN/GaN HEMTs on flexible substrates
IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2013, 60, 1054-1059Compte-rendu et recension critique d'ouvrage -
Improved performance of flexible CMOS technology using ultimate thinning and transfer bonding
6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-09-2016, 6th Electronic System-Integration Technology Conference (ESTC), IEEE, 2016Communication dans un congrès avec actes -
Large-area femtosecond laser ablation of Silicon to create membrane with high performance CMOS-SOI RF functions
2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, 18-09-2018, Proceedings of 7th Electronics System-Integration Technology Conference, ESTC 2018, Dresden, Germany, IEEE, 21-09-2018Communication dans un congrès avec actes